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SMT Surface Mount 1.27MM Pitch Female Header Connector Dual Row Gold Flash PA6T PCB Assembly

SMT Surface Mount 1.27MM Pitch Female Header Connector Dual Row Gold Flash PA6T PCB Assembly

  • SMT Surface Mount 1.27MM Pitch Female Header Connector Dual Row Gold Flash PA6T PCB Assembly
  • SMT Surface Mount 1.27MM Pitch Female Header Connector Dual Row Gold Flash PA6T PCB Assembly
  • SMT Surface Mount 1.27MM Pitch Female Header Connector Dual Row Gold Flash PA6T PCB Assembly
SMT Surface Mount 1.27MM Pitch Female Header Connector Dual Row Gold Flash PA6T PCB Assembly
Product Details:
Place of Origin: China
Brand Name: CNJWY
Certification: UL/SGS/ROHS/REACH
Model Number: FH-FBB7F-03
Payment & Shipping Terms:
Minimum Order Quantity: 2K
Price: 0.01~0.2
Packaging Details: Tube/Tray/Reel Packaging
Delivery Time: 7 to 10days
Payment Terms: T/T, Western Union, MoneyGram
Supply Ability: 10000000PCS/Month
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Detailed Product Description
Pitch: 1.27MM X 1.27MM Configuration: Dual Row
Orientation: Vertical (Straight) Available Pin Count: 04P To 80P
Contact Plating: Gold Flash Over Nickel Insulator Material: PA6T+30%GF UL94V-0
Current Rating: 1.0 AMP Withstand Voltage: 250V AC/DC
Contact Material: Phosphor Bronze Mounting Type: SMT Surface Mount
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SMT female header connector 1.27mm pitch

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Dual row header connector gold flash

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PA6T PCB assembly header connector

CNJWY introduces its advanced SMT Surface Mount 1.27MM Pitch Dual Row Female Header Connector, purpose-built for high-volume automated PCB assembly environments. The 1.27mm fine pitch delivers twice the interconnect density of traditional 2.54mm connectors within the identical board footprint, making it an optimal choice for miniaturized electronics where PCB real estate is at a advanced. Each connector features precision flat-coplanar SMT leads engineered for consistent solder joint formation during infrared or vapor-phase reflow processes. The gold flash plating on phosphor bronze contacts ensures reliable low-resistance electrical connections, while the PA6T high-temperature thermoplastic housing withstands the full lead-free reflow thermal profile without deformation. Dual row configurations from 02-position to 80-position provide flexible high-density solutions for board-to-board stacking in portable devices, IoT modules, and compact industrial controllers.

Key Features
  • Fine 1.27MM Pitch High Density: At half the pitch of conventional 2.54mm connectors, this design doubles the signal connection density per unit of PCB area. A 40-position dual row 1.27mm connector occupies approximately the same footprint as a 20-position single row 2.54mm header, enabling significant board miniaturization.
  • Reflow-Compatible SMT Termination: The gull-wing SMT leads are optimized for automated pick-and-place assembly with standard solder paste stencil processes. Co-planarity is maintained within 0.10mm across all leads, ensuring consistent solder wetting and fillet formation during lead-free reflow profiles peaking at 260°C.
  • Gold Flash Contact System: Uniform gold flash plating over a nickel diffusion barrier ensures contact resistance remains below 20mΩ, providing stable signal integrity for both low-level analog signals and digital communication buses across the rated 300 mating cycle lifetime.
  • PA6T High-Temperature Housing: The glass-fiber-reinforced PA6T insulator achieves UL94V-0 flammability classification and exhibits negligible dimensional change through the entire lead-free reflow cycle, maintaining pin position accuracy for reliable mating alignment post-assembly.
  • Automated Assembly Optimized: Flat-upper insulator design with clearly defined vacuum pickup zones enables reliable handling by standard SMT placement nozzles. Tape-and-reel packaging with 16mm or 24mm carrier widths integrates seamlessly with all mainstream pick-and-place platforms.
  • Comprehensive Pin Count Coverage: The extensive dual row pin count range from 04P (2x2) to 80P (2x40) accommodates diverse design requirements, from miniature sensor modules needing only a few signal lines to complex data acquisition systems requiring dozens of parallel interconnects.
Technical Specifications
ParameterSpecification
Pitch1.27MM x 1.27MM Row Spacing
ConfigurationDual Row
OrientationVertical (Straight)
Available Pin Count04P, 06P, 08P, 10P, 12P, 14P, 16P, 20P, 24P, 30P, 34P, 40P, 50P, 64P, 80P
Contact MaterialPhosphor Bronze
Contact PlatingGold Flash (Au) over Nickel (Ni)
Insulator MaterialPA6T + 30% GF (UL94V-0)
Current Rating1.0 AMP per contact
Contact Resistance20mΩ Maximum
Insulation Resistance1000MΩ Minimum at 500V DC
Withstand Voltage250V AC/DC for 1 minute
Operating Temperature-40°C to +105°C
Lead Coplanarity0.10mm Maximum
Insertion Force1.5N Maximum per pin
Withdrawal Force0.2N Minimum per pin
Durability300 Mating Cycles Minimum
Solder ProfileJ-STD-020 Lead-Free Reflow Compatible
Solder Temperature260°C Peak for 10 seconds
TerminationSMT Gull-Wing Lead
Applications

The 1.27mm pitch SMT female header connector addresses miniaturization challenges across the electronics industry. Portable consumer devices including smartphones, tablets, and wearable electronics leverage the fine pitch for high-density interconnects within extremely constrained enclosures. Internet of Things (IoT) sensor nodes, edge computing gateways, and smart home controllers employ these connectors for modular PCB stacking in compact form factors. Medical wearable devices, portable diagnostic tools, and implant communication modules benefit from the connector's small footprint and reliable SMT assembly. Industrial applications include compact PLC expansion modules, remote I/O blocks, and distributed sensor interface boards. Additional deployment scenarios encompass drone flight controllers, automotive ADAS camera modules, solid-state lighting drivers, and portable test and measurement instrumentation requiring dense board-to-board interconnections.

Packaging & Quality Assurance

CNJWY SMT female header connectors are supplied in industry-standard tape-and-reel packaging for seamless automated assembly integration. Standard reel quantities range from 500 to 2,000 pieces depending on pin count, with 330mm diameter reels accommodating standard feeder mechanisms. All components are packaged in moisture-barrier bags with desiccant and humidity indicator cards, meeting IPC/JEDEC J-STD-020 MSL Level 3 requirements. ESD-safe conductive carrier tape ensures component protection throughout handling and placement. Every production lot undergoes automated optical inspection (AOI) for lead coplanarity, dimensional conformance, and surface finish quality. CNJWY manufacturing is ISO9001:2015 certified with UL, SGS, ROHS, and REACH compliance across all product lines. Custom solder pad layouts, selective gold plating thicknesses, and bespoke pin configurations are available through our OEM engineering support team. Standard delivery time is 7-10 working days with a minimum order quantity of 2,000 pieces.

Contact Details
ShenZhen JWY Electronic Co.,Ltd

Contact Person: Mr. Steven Luo

Tel: 8615013506937

Fax: 86-755-29161263

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